Abstract: Gold wire ball thermosonic bonding process is a key process of internal interconnection of hybrid integrated circuits, which plays a decisive role in the performance and reliability of ...

A new framework, built using Nvidia Omniverse, Microsoft Azure and accelerated Synopsys physics, has already been deployed by ...

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Abstract: In this work a numerical simulation model for chip to wafer hybrid bonding process with polymer dielectrics is developed using finite element analysis. Virtual design of experiments is ...