Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...

How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...

Imec has developed a Cu-to-Cu and SiCN-to-SiCN die-to-wafer bonding process resulting in a Cu bond pad pitch of only 2µm at <350nm die-to-wafer overlay error, achieving good electrical yield. Such ...

Unpatterned wafer inspection, which has flown well under the radar for most of the semiconductor industry, is becoming more critical amid the need to find defects earlier in the manufacturing process ...

A research team led by Professor Sanghyeon Choi from the Department of Electrical Engineering and Computer Science at DGIST ...

Enables earlier narrowing down of process and device options, reducing expensive and time-consuming wafer-based iterations Allows creation of higher-quality early Process Design Kits (PDKs) for design ...

Chinese researchers have unveiled a new “fancy tool” that can pinpoint the source of manufacturing flaws during microchip production. According to the team, the new technology can cut errors by as ...

Charlotte, N.C., May 03, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW) ...

The first WLCSP device is expected to be technology qualified later this quarter with production release expected in the June 2021 quarter. The new package offers a significantly smaller filter ...