AMD's new Ryzen AI Max+ 395 'Strix Halo' APU tested inside of new Mini-PC: up to 140W power at the ready, up to 128GB of ...
SanDisk describes HBF as stacking up to 16 layers of BiCS 3D NAND with through-silicon vias (TSVs). A logic layer enables ...
Strix Halo, AMD's upcoming and extremely large APU, has finally seen some benchmarks in 3DMark Time Spy. These early results ...
Integrated graphics cards have been fighting an uphill battle for many years, often failing to achieve anything near what discrete GPUs are capable of in raw power, but a new AMD Strix Halo leak could ...