Imec invites the global automotive ecosystem to join its effort to mutually explore the opportunities presented by chiplet ...

The automotive industry stands on the cusp of a technological renaissance, ushering in an era where vehicles aren't just tools of transportation but interconnected ...

SEMIFIVE today announced the expansion of its collaboration with Arm to deliver the proven high-performance computing ...

SEMIFIVE has announced the conclusion of a contract with HyperAccel to develop a generative AI chip, Bertha, for mass ...

Strong demand for foundry TSMC’s leading-edge wafer processing continued in September allowing the company to beat the sales guidance it gave for 3Q24 back in July.

In this interview, Antti Rauhala, Vice President of Engineering at CoreHW, sheds light on CHW3021, an innovative radio front-end integrated circuit (IC). He delves into its advanced features, ...

The PCIe 3.0 PHY IP is designed to support increased applications with its low-power, multi-lane, high-performance design. It fully supports a wide range of PCIe 3.0 Base applications and complies ...

T2M-IP, the global leader in semiconductor IP cores and technology expertise, is proud to announce the immediate availability of its partner's VESA-compliant DisplayPort v1.4 Rx PHY and Controller IP ...

PVTSENU28HPCP is an IP for process voltage and temperature sensing of the silicon chip die. It has unique features like voltage and temperature probes without needing dedicated analog current and ...

No portion of this site may be copied, retransmitted, reposted, duplicated or otherwise used without the express written permission of Design And Reuse.

The companies have integrated Crypto Quantique’s QDID physical unclonable function (PUF) with Attopsemi’s I-fuse® OTP ...

As 5G wireless communications systems continue to be deployed, enterprises are busy planning for 6G—the next generation of ...