The solution comes in the form of a change in the design methodology for SiP products. A co-design environment that accommodates the RFIC flow and links this schematic-based flow to package ...
With almost 10 million SiP shipment, GUC SiP service leads to a fast, low cost, and low risk way to realize products with high embedded memory requirements Hsinchu, Taiwan -- April 14, 2008 –Global ...
Parts 1 and 2 of this three-part series reviewed the basics and SiP package technology and detailed the design challenges specific to RF SiPs. In this final installment, the author outlines the steps ...
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