Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
Approximate $7 billion investment over the next several years to meet AI data center demandSINGAPORE, Jan. 08, 2025 (GLOBE NEWSWIRE) -- (Nasdaq: MU) broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company’s current facilities in Singapore.